Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810892 | Method of direct bonding semiconductor components | Jaber Derakhshandeh, Eric Beyne | 2023-11-07 |
| 10886252 | Method of bonding semiconductor substrates | Lan Peng, Soon-Wook Kim, Eric Beyne, Erik Sleeckx, Robert C. Miller | 2021-01-05 |
| 10141284 | Method of bonding semiconductor substrates | Soon-Wook Kim, Lan Peng, Patrick Verdonck, Robert C. Miller, Eric Beyne | 2018-11-27 |
| 7745935 | Method to create super secondary grain growth in narrow trenches | Sywert Brongersma | 2010-06-29 |
| 7560357 | Method for creating narrow trenches in dielectric materials | — | 2009-07-14 |
| 7452812 | Method to create super secondary grain growth in narrow trenches | Sywert Brongersma | 2008-11-18 |
| 7319274 | Methods for selective integration of airgaps and devices made by such methods | Jean Paul Gueneau de Mussy, Karen Maex, Victor Sutcliffe | 2008-01-15 |
| 7078352 | Methods for selective integration of airgaps and devices made by such methods | Jean Paul Gueneau de Mussy, Karen Maex, Victor Sutcliffe | 2006-07-18 |
| 7037851 | Methods for selective integration of airgaps and devices made by such methods | Jean Paul Gueneau de Mussy, Karen Maex | 2006-05-02 |
| 6245653 | Method of filling an opening in an insulating layer | Karen Maex, Joris Proost | 2001-06-12 |