Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141284 | Method of bonding semiconductor substrates | Soon-Wook Kim, Lan Peng, Robert C. Miller, Gerald Beyer, Eric Beyne | 2018-11-27 |
| 8974870 | Fabrication of porogen residues free low-k materials with improved mechanical and chemical resistance | Mikhail Baklanov, Quoc Toan Le, Laurent Souriau | 2015-03-10 |
| 7381452 | Amorphous hydrogenated carbon film | Luiz Goncalves Neto, Ronaldo D. Mansano, Giuseppe Cirino, Luiz S. Zambom | 2008-06-03 |