Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297541 | Multiple-component substrate for a microelectronic device | Min Suet Lim, Mooi Ling Chang, Say Thong Tony Tan, Tin Poay Chuah | 2019-05-21 |
| 10256519 | Stranded transmission line and uses thereof | Wil Choon Song, Khang Choong Yong, Min Suet Lim, Boon Ping Koh | 2019-04-09 |
| 10256213 | Reduced-height electronic memory system and method | Min Suet Lim, Jiun Hann Sir | 2019-04-09 |
| 10163777 | Interconnects for semiconductor packages | Seok Ling Lim, Hoay Tien Teoh, Jenny Shio Yin Ong, Jia Yan Go, Jiun Hann Sir +1 more | 2018-12-25 |
| 10153253 | Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus | Howe Yin Loo, Min Suet Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong | 2018-12-11 |
| 10083922 | Inductor interconnect | Min Suet Lim, Chin Lee Kuan, Khang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong +1 more | 2018-09-25 |
| 10014710 | Foldable fabric-based packaging solution | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi, Mark A. Schaecher, Teong Guan Yew | 2018-07-03 |
| 9972589 | Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer | Min Suet Lim, Jiun Hann Sir, Seok Ling Lim, Hoay Tien Teoh | 2018-05-15 |
| 9960224 | Three capacitor stack and associated methods | Jiun Hann Sir, Han Kung Chua, Min Suet Lim, Hoay Tien Teoh | 2018-05-01 |
| 9907170 | FPC connector for better signal integrity and design compaction | Hoay Tien Teoh | 2018-02-27 |
| 9893444 | Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices | Jackson Chung Peng Kong, Bok Eng Cheah, Su Sin Florence Phun, Khang Choong Yong, Min Keen Tang | 2018-02-13 |
| 9836095 | Microelectronic device package electromagnetic shield | Min Suet Lim, Khang Choong Yong, Boon Ping Koh, Wil Choon Song | 2017-12-05 |
| 9613920 | Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias | Hoay Tien Teoh | 2017-04-04 |
| 9606949 | Universal scalable system: on-the-fly system performance conversion via PC-on-a-card and USB for smart devices and IoT enabling | Khang Choong Yong, Khai Ern See, Amit Kumar Srivastava, Jackson Chung Peng Kong, Teong Keat Beh | 2017-03-28 |
| 9257368 | Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias | Hoay Tien Teoh | 2016-02-09 |
| 7795736 | Interconnects with interlocks | Jiun Hann Sir | 2010-09-14 |
| 7642660 | Method and apparatus for reducing electrical interconnection fatigue | Cheng Siew Tay, Swee Kian Cheng | 2010-01-05 |
| 7217651 | Interconnects with interlocks | Jiun Hann Sir | 2007-05-15 |
| 7173342 | Method and apparatus for reducing electrical interconnection fatigue | Cheng Siew Tay, Swee Kian Cheng | 2007-02-06 |