Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682844 | Heatsink antenna array structure | Jiawei Qian, Yueping Zhang, Junfa Mao | 2023-06-20 |
| 11189574 | Microelectronic package having electromagnetic interference shielding | Li-Sheng Weng, Chung-Hao Chen, James C. Matayabas, Jr. | 2021-11-30 |
| 10522898 | Integration of millimeter wave antennas in reduced form factor platforms | Ana M. Yepes, Yaniv Michaeli, Menashe Soffer | 2019-12-31 |
| 9900976 | Integrated circuit package including floating package stiffener | Chung-Hao Chen, Li-Sheng Weng | 2018-02-20 |
| 9893444 | Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices | Jackson Chung Peng Kong, Eng Huat Goh, Bok Eng Cheah, Su Sin Florence Phun, Khang Choong Yong | 2018-02-13 |