Issued Patents All Time
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205613 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Jiun Hann Sir, Poh Boon Khoo | 2021-12-21 |
| 11177226 | Flexible shield for semiconductor devices | Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim | 2021-11-16 |
| 11178768 | Flexible printed circuit EMI enclosure | Khang Choong Yong, Stephen H. Hall, Tin Poay Chuah, Boon Ping Koh | 2021-11-16 |
| 11172581 | Multi-planar circuit board having reduced z-height | Min Suet Lim, Tin Poay Chuah, Han Kung Chua | 2021-11-09 |
| 11133261 | Electronic device packaging | Min Suet Lim, Chee Kheong Yoon, Jia Yan Go | 2021-09-28 |
| 11114421 | Integrating system in package (SiP) with input/output (IO) board for platform miniaturization | Wee Hoe, Khang Choong Yong, Ping Ping Ooi | 2021-09-07 |
| 10998262 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Amruthavalli Pallavi Alur, Debendra Mallik | 2021-05-04 |
| 10943864 | Programmable redistribution die | Min Suet Lim, J-Wing Teh, Bok Eng Cheah | 2021-03-09 |
| 10923415 | Semiconductor package having integrated stiffener region | Jiun Hann Sir, Min Suet Lim, Shawna M. Liff, Feras Eid | 2021-02-16 |
| 10861839 | Dynamic random access memory (DRAM) mounts | Hoay Tien Teoh | 2020-12-08 |
| 10856454 | Electromagnetic interference (EMI) shield for circuit card assembly (CCA) | Min Suet Lim, Yew San Lim, Jia Yan Go, Tin Poay Chuah | 2020-12-01 |
| 10796999 | Floating-bridge interconnects and methods of assembling same | Boon Ping Koh, Jiun Hann Sir, Khang Choong Yong, Min Suet Lim, Wil Choon Song | 2020-10-06 |
| 10785872 | Package jumper interconnect | Hoay Tien Teoh | 2020-09-22 |
| 10772206 | Board to board interconnect | Chee Ling Wong, Wil Choon Song, Khang Choong Yong, Mohd Muhaiyiddin Bin Abdullah, Tin Poay Chuah | 2020-09-08 |
| 10716209 | Fiber weave-sandwiched differential pair routing technique | Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim | 2020-07-14 |
| 10643983 | Extended stiffener for platform miniaturization | Bok Eng Cheah, Jackson Chung Peng Kong, Min Suet Lim, Khang Choong Yong, Howe Yin Loo | 2020-05-05 |
| 10636749 | Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same | Kean Huat Leong, Chun Kit See, Sheng Jian Darren Tan, Paik Wen Ong | 2020-04-28 |
| 10609813 | Capacitive interconnect in a semiconductor package | Min Suet Lim, Fern Nee Tan, Khang Choong Yong, Jiun Hann Sir | 2020-03-31 |
| 10606316 | Flexible computing device that includes a plurality of displays | Jackson Chung Peng Kong, Kooi Chi Ooi, Bok Eng Cheah | 2020-03-31 |
| 10492299 | Electronic assembly that includes a substrate bridge | Hoay Tien Teoh, Jia Yan Go, Jenny Shio Yin Ong | 2019-11-26 |
| 10438882 | Integrated circuit package with microstrip routing and an external ground plane | — | 2019-10-08 |
| 10411001 | Dynamic random access memory (DRAM) mounts | Hoay Tien Teoh | 2019-09-10 |
| 10388636 | Integrating system in package (SIP) with input/output (IO) board for platform miniaturization | Wee Hoe, Khang Choong Yong, Ping Ping Ooi | 2019-08-20 |
| 10356902 | Board to board interconnect | Chee Ling Wong, Wil Choon Song, Khang Choong Yong, Mohd Muhaiyiddin Bin Abdullah, Tin Poay Chuah | 2019-07-16 |
| 10317938 | Apparatus utilizing computer on package construction | Khai Ern See, Damien Weng Kong Chong, Min Suet Lim, Ping Ping Ooi, Chu Aun Lim +6 more | 2019-06-11 |