Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400952 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2025-08-26 |
| 11908793 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2024-02-20 |
| 11699644 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Jiun Hann Sir, Eng Huat Goh | 2023-07-11 |
| 11658111 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2023-05-23 |
| 11322434 | Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages | Jiun Hann Sir, Eng Huat Goh | 2022-05-03 |
| 11205613 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Jiun Hann Sir, Eng Huat Goh | 2021-12-21 |
| 10998262 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2021-05-04 |