Poh Boon Khoo — 7 Patents at Intel

Poh Boon Khoo has been granted 7 US patents while listed as an inventor at Intel. The first was granted in 2021 and the most recent in August 2025. Poh Boon Khoo ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list Poh Boon Khoo in Permatang Pauh, MY.

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Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12400952	Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge	Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik	2025-08-26
11908793	Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge	Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik	2024-02-20	$26,968,000
11699644	Organic mold interconnects in shielded interconnects frames for integrated-circuit packages	Jiun Hann Sir, Eng Huat Goh	2023-07-11	$21,736,000
11658111	Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge	Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik	2023-05-23	$11,397,000
11322434	Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages	Jiun Hann Sir, Eng Huat Goh	2022-05-03	$16,346,000
11205613	Organic mold interconnects in shielded interconnects frames for integrated-circuit packages	Jiun Hann Sir, Eng Huat Goh	2021-12-21	$33,282,000
10998262	Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge	Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik	2021-05-04	$37,420,000

Poh Boon Khoo — 7 Patents

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