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Home › Organic mold interconnects in shielded interconnects frames for integrated-circuit packages

Organic mold interconnects in shielded interconnects frames for integrated-circuit packages

US Patent 11205613 · Granted Dec 21, 2021

Estimated economic value: $33,282,000 ⓘ

Assignee

Intel

Inventors

Jiun Hann Sir (33 patents)
Eng Huat Goh (70 patents)
Poh Boon Khoo (7 patents)

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