Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636749 | Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same | Kean Huat Leong, Sheng Jian Darren Tan, Paik Wen Ong, Eng Huat Goh | 2020-04-28 |