Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stacked dice systems

Stacked dice systems

US Patent 10916524 · Granted Feb 9, 2021

Estimated economic value: $44,388,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vertical interconnect design for improved electrical performance2025
Vertical interconnect design for improved electrical performance2025
Vertical interconnect design for improved electrical performance2025
Integrated bridge frame for package substrate2025
Integrated bridge frame for package substrate2025
Integrated bridge frame for package substrate2025
Recessed vertical interconnects for device miniaturization2025
Recessed vertical interconnects for device miniaturization2025
Asymmetrical laminated circuit boards for improved electrical performance2025
Asymmetrical laminated circuit boards for improved electrical performance2025
Semiconductor package with hybrid mold layers2025
Semiconductor package with hybrid mold layers2025