Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Recessed vertical interconnects for device miniaturization

Recessed vertical interconnects for device miniaturization

US Patent 12412784 · Granted Sep 9, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vertical interconnect design for improved electrical performance2025
Vertical interconnect design for improved electrical performance2025
Integrated bridge frame for package substrate2025
Integrated bridge frame for package substrate2025
Asymmetrical laminated circuit boards for improved electrical performance2025
Asymmetrical laminated circuit boards for improved electrical performance2025
Semiconductor package with hybrid mold layers2025
Semiconductor package with hybrid mold layers2025
Hybrid boards with embedded planes2025
Hybrid boards with embedded planes2025
Molded silicon interconnects in bridges for integrated-circuit packages2025
Molded silicon interconnects in bridges for integrated-circuit packages2025