Molded silicon interconnects in bridges for integrated-circuit packages

Assignee

• Intel

Inventors

• Bok Eng Cheah (138 patents)
• Jenny Shio Yin Ong (44 patents)
• Seok Ling Lim (43 patents)
• Jackson Chung Peng Kong (118 patents)
• Kooi Chi Ooi (59 patents)

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