Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948716 | Power modules with elevated inductors and capacitors arranged under the inductors | Houle Gan, Shuai Jiang, Gregory Sizikov, Xin Li | 2024-04-02 |
| 11552634 | Power sequencing in an active silicon interposer | Houle Gan, Mikhail Popovich, Shuai Jiang, Gregory Sizikov | 2023-01-10 |
| 10905038 | Electromagnetic interference (“EMI”) sheet attenuators | Federico P. Centola, Zuowei Shen, Xu Gao, Shawn E. Bender, Melanie Beauchemin +2 more | 2021-01-26 |
| 10742211 | Power sequencing in an active silicon interposer | Houle Gan, Mikhail Popovich, Shuai Jiang, Gregory Sizikov | 2020-08-11 |
| 10312813 | Multi-phase converter | Shuai Jiang, Xin Li | 2019-06-04 |
| 10141849 | Multi-phase converter | Shuai Jiang, Xin Li | 2018-11-27 |
| 9966842 | Parallel voltage regulator with switched capacitor or capacitor-inductor blocks | Shuai Jiang, Chenhao Nan, Xin Li, Mobashar Yazdani | 2018-05-08 |
| 7239524 | Resistive element apparatus and method | Robert L. Sankman, Alex Waizman | 2007-07-03 |
| 7176565 | Capacitors having separate terminals on three or more sides | Yuan-Liang Li, David G. Figueroa | 2007-02-13 |
| 7173329 | Package stiffener | Kristopher Frutschy, Bob Sankman | 2007-02-06 |
| 7133294 | Integrated circuit packages with sandwiched capacitors | Priyavadan R. Patel, David G. Figueroa, Robert L. Sankman, Yuan-Liang Li, Hong Xie +1 more | 2006-11-07 |
| 7109569 | Dual referenced microstrip | James Breisch, Alex Waizman, Teong Guan Yew | 2006-09-19 |
| 6946824 | Power delivery system having a plurality of stages and method for setting power delivery system parameters | Alex Waizman | 2005-09-20 |
| 6900991 | Electronic assembly with sandwiched capacitors and methods of manufacture | Priyavadan R. Patel, David G. Figueroa, Robert L. Sankman, Yuan-Liang Li, Hong Xie +1 more | 2005-05-31 |
| 6877223 | Method of fabrication for a socket with embedded conductive structure | David G. Figueroa, Kristopher Frutschy, Farzaneh Yahyaei-Moayyed | 2005-04-12 |
| 6717277 | Electrical assembly with vertical multiple layer structure | David G. Figueroa, Robert L. Sankman | 2004-04-06 |
| 6686819 | Dual referenced microstrip | James Breisch, Alex Waizman, Teong Guan Yew | 2004-02-03 |
| 6680218 | Fabrication method for vertical electronic circuit package and system | David G. Figueroa, Robert L. Sankman | 2004-01-20 |
| 6657275 | Pad and via placement design for land side capacitors | David G. Figueroa, Yuan-Liang Li | 2003-12-02 |
| 6636416 | Electronic assembly with laterally connected capacitors and manufacturing method | Yuan-Liang Li | 2003-10-21 |
| 6584685 | System and method for package socket with embedded power and ground planes | David G. Figueroa, Kris Frutschy, Bob Sankman, Farzaneh Yahyaei-Moayyed | 2003-07-01 |
| 6559484 | Embedded enclosure for effective electromagnetic radiation reduction | Yuan-Liang Li, David G. Figueroa | 2003-05-06 |
| 6558181 | System and method for package socket with embedded power and ground planes | David G. Figueroa, Kris Frutschy, Bob Sankman, Farzaneh Yahyaei-Moayyed | 2003-05-06 |
| 6555920 | Vertical electronic circuit package | David G. Figueroa, Robert L. Sankman | 2003-04-29 |
| 6509640 | Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction | Yuan-Liang Li, David G. Figueroa | 2003-01-21 |