| 11948716 |
Power modules with elevated inductors and capacitors arranged under the inductors |
Houle Gan, Shuai Jiang, Gregory Sizikov, Xin Li |
2024-04-02 |
$80,757,000 |
| 11552634 |
Power sequencing in an active silicon interposer |
Houle Gan, Mikhail Popovich, Shuai Jiang, Gregory Sizikov |
2023-01-10 |
$48,235,000 |
| 10905038 |
Electromagnetic interference (“EMI”) sheet attenuators |
Federico P. Centola, Zuowei Shen, Xu Gao, Shawn E. Bender, Melanie Beauchemin +2 more |
2021-01-26 |
$90,214,000 |
| 10742211 |
Power sequencing in an active silicon interposer |
Houle Gan, Mikhail Popovich, Shuai Jiang, Gregory Sizikov |
2020-08-11 |
$46,384,000 |
| 10312813 |
Multi-phase converter |
Shuai Jiang, Xin Li |
2019-06-04 |
$25,525,000 |
| 10141849 |
Multi-phase converter |
Shuai Jiang, Xin Li |
2018-11-27 |
$20,468,000 |
| 9966842 |
Parallel voltage regulator with switched capacitor or capacitor-inductor blocks |
Shuai Jiang, Chenhao Nan, Xin Li, Mobashar Yazdani |
2018-05-08 |
$18,009,000 |
| 7239524 |
Resistive element apparatus and method |
Robert L. Sankman, Alex Waizman |
2007-07-03 |
$20,127,000 |
| 7176565 |
Capacitors having separate terminals on three or more sides |
Yuan-Liang Li, David G. Figueroa |
2007-02-13 |
$12,105,000 |
| 7173329 |
Package stiffener |
Kristopher Frutschy, Bob Sankman |
2007-02-06 |
$13,917,000 |
| 7133294 |
Integrated circuit packages with sandwiched capacitors |
Priyavadan R. Patel, David G. Figueroa, Robert L. Sankman, Yuan-Liang Li, Hong Xie +1 more |
2006-11-07 |
$13,207,000 |
| 7109569 |
Dual referenced microstrip |
James Breisch, Alex Waizman, Teong Guan Yew |
2006-09-19 |
$12,802,000 |
| 6946824 |
Power delivery system having a plurality of stages and method for setting power delivery system parameters |
Alex Waizman |
2005-09-20 |
$19,561,000 |
| 6900991 |
Electronic assembly with sandwiched capacitors and methods of manufacture |
Priyavadan R. Patel, David G. Figueroa, Robert L. Sankman, Yuan-Liang Li, Hong Xie +1 more |
2005-05-31 |
$34,079,000 |
| 6877223 |
Method of fabrication for a socket with embedded conductive structure |
David G. Figueroa, Kristopher Frutschy, Farzaneh Yahyaei-Moayyed |
2005-04-12 |
$19,475,000 |
| 6717277 |
Electrical assembly with vertical multiple layer structure |
David G. Figueroa, Robert L. Sankman |
2004-04-06 |
$23,009,000 |
| 6686819 |
Dual referenced microstrip |
James Breisch, Alex Waizman, Teong Guan Yew |
2004-02-03 |
$41,560,000 |
| 6680218 |
Fabrication method for vertical electronic circuit package and system |
David G. Figueroa, Robert L. Sankman |
2004-01-20 |
$75,155,000 |
| 6657275 |
Pad and via placement design for land side capacitors |
David G. Figueroa, Yuan-Liang Li |
2003-12-02 |
$54,763,000 |
| 6636416 |
Electronic assembly with laterally connected capacitors and manufacturing method |
Yuan-Liang Li |
2003-10-21 |
$72,934,000 |
| 6584685 |
System and method for package socket with embedded power and ground planes |
David G. Figueroa, Kris Frutschy, Bob Sankman, Farzaneh Yahyaei-Moayyed |
2003-07-01 |
$52,453,000 |
| 6559484 |
Embedded enclosure for effective electromagnetic radiation reduction |
Yuan-Liang Li, David G. Figueroa |
2003-05-06 |
$49,233,000 |
| 6558181 |
System and method for package socket with embedded power and ground planes |
David G. Figueroa, Kris Frutschy, Bob Sankman, Farzaneh Yahyaei-Moayyed |
2003-05-06 |
$49,233,000 |
| 6555920 |
Vertical electronic circuit package |
David G. Figueroa, Robert L. Sankman |
2003-04-29 |
$39,757,000 |
| 6509640 |
Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction |
Yuan-Liang Li, David G. Figueroa |
2003-01-21 |
$41,003,000 |
