Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229887 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias | 2019-03-12 |
| 10224290 | Electromagnetically shielded electronic devices and related systems and methods | Rajendra C. Dias, Takashi Kumamoto, Yoshishiro Tomita, Joshua D. Heppner, Eric J. Li | 2019-03-05 |
| 10199354 | Die sidewall interconnects for 3D chip assemblies | Digvijay A. Raorane | 2019-02-05 |
| 9847304 | Electronic device packages with conformal EMI shielding and related methods | Eric J. Li, Joshua D. Heppner, Rajendra C. Dias | 2017-12-19 |
| 9704811 | Perforated conductive material for EMI shielding of semiconductor device and components | Rajendra C. Dias, Joshua D. Heppner, Anna M. Prakash | 2017-07-11 |
| 9516752 | Underfill device and method | Patricia Brusso, Carolyn R. McCormick, Ruben Cadena, Sankara J. Subramanian, Edward L. Martin | 2016-12-06 |
| 8399291 | Underfill device and method | Patricia Brusso, Carolyn R. McCormick, Ruben Cadena, Sankara J. Subramanian, Edward L. Martin | 2013-03-19 |
| 7745917 | Compliant integrated circuit package substrate | Biju Chandran | 2010-06-29 |
| 7719109 | Embedded capacitors for reducing package cracking | Sudarshan Rangaraj, Shankar Ganapathysubramanian, Richard J. Harries, Sankara J. Subramanian | 2010-05-18 |
| 7691667 | Compliant integrated circuit package substrate | Biju Chandran | 2010-04-06 |
| 7692307 | Compliant structure for an electronic device, method of manufacturing same, and system containing same | Sudarshan Rangaraj, Shankar Ganapathysubramanian, Richard J. Harries, Sankara J. Subramanian | 2010-04-06 |
| 7633142 | Flexible core for enhancement of package interconnect reliability | Patricia Brusso, Ruben Cadena, Carolyn R. McCormick, Sankara J. Subramanian | 2009-12-15 |
| 7352061 | Flexible core for enhancement of package interconnect reliability | Patricia Brusso, Ruben Cadena, Carolyn R. McCormick, Sankara J. Subramanian | 2008-04-01 |