Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7585693 | Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method | Kristopher Frutschy, Sudarshan Rangaraj | 2009-09-08 |
| 7326065 | Bridge clip with reinforced stiffener | Kris Frutschy, Kyle Kippes | 2008-02-05 |
| 6786739 | Bridge clip with reinforced stiffener | Kris Frutschy, Kyle Kippes | 2004-09-07 |