Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12225336 | Systems and methods to secure fabric to speaker-based devices | Xuan Geng, Wentao Cheng, Shankar Ganapathysubramanian | 2025-02-11 |
| 7615479 | Assembly comprising functional block deposited therein | Gordon S. W. Craig, Mark A. Hadley, Ali A. Tootoonchi, Eric Kanemoto, Eric Snyder +3 more | 2009-11-10 |
| 7576656 | Apparatuses and methods for high speed bonding | Gordon S. W. Craig, Randolph Eisenhardt, Ming Chan | 2009-08-18 |
| 7214569 | Apparatus incorporating small-feature-size and large-feature-size components and method for making same | Mark A. Hadley, Paul S. Drzaic, Gordon S. W. Craig, Glenn Gengel, Scott Hermann +2 more | 2007-05-08 |
| 6268656 | Method and structure for uniform height solder bumps on a semiconductor wafer | Jacques Leibovitz | 2001-07-31 |
| 6146984 | Method and structure for uniform height solder bumps on a semiconductor wafer | Jacques Leibovitz | 2000-11-14 |
| 6085968 | Solder retention ring for improved solder bump formation | Hubert A. Vander Plas, Jacques Leibovitz | 2000-07-11 |
| 6011314 | Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps | Jacques Leibovitz, Park-Kee Yu, Ya Yun Zhu, Maria L. Cobarruviaz, Cheng-Cheng Chang +1 more | 2000-01-04 |