Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672626 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Nitin A. Deshpande, Nachiket R. Raravikar, Eric J. Li | 2020-06-02 |
| 9607964 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Nitin A. Deshpande, Nachiket R. Raravikar, Eric J. Li | 2017-03-28 |