Semiconductor packaging with high density interconnects

Assignee

• Intel

Inventors

• Adel A. Elsherbini (270 patents)
• Johanna M. Swan (301 patents)
• Shawna M. Liff (201 patents)
• Henning Braunisch (119 patents)
• Krishna Bharath (48 patents)
• Javier Soto Gonzalez (23 patents)
• Javier A. Falcon (16 patents)

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