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Home › Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

US Patent 12150271 · Granted Nov 19, 2024

Estimated economic value: $25,575,000 ⓘ

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