Issued Patents All Time
Showing 51–75 of 261 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967580 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan | 2024-04-23 |
| 11933555 | Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections | Feras Eid, Johanna M. Swan | 2024-03-19 |
| 11916020 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan | 2024-02-27 |
| 11916006 | Microelectronic assemblies having an integrated voltage regulator chiplet | Kaladhar Radhakrishnan, Krishna Bharath, Shawna M. Liff, Johanna M. Swan | 2024-02-27 |
| 11908802 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati | 2024-02-20 |
| 11901330 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar | 2024-02-13 |
| 11895815 | Additive manufacturing for integrated circuit assembly cables | Georgios Dogiamis, Feras Eid | 2024-02-06 |
| 11887946 | Semiconductor packages with antennas | Telesphor Kamgaing, Sasha N. Oster | 2024-01-30 |
| 11887944 | Additive manufacturing for integrated circuit assembly connectors | Georgios Dogiamis, Feras Eid | 2024-01-30 |
| 11881457 | Semiconductor packaging with high density interconnects | Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more | 2024-01-23 |
| 11842826 | Additive manufacturing for integrated circuit assembly connector support structures | Feras Eid, Johanna M. Swan, Georgios Dogiamis | 2023-12-12 |
| 11830831 | Semiconductor package including a modular side radiating waveguide launcher | Georgios Dogiamis, Sasha N. Oster, Johanna M. Swan, Shawna M. Liff, Telesphor Kamgaing +1 more | 2023-11-28 |
| 11823972 | Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices | Feras Eid, Johanna M. Swan | 2023-11-21 |
| 11791528 | Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line | Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2023-10-17 |
| 11791277 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2023-10-17 |
| 11784181 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Feras Eid, Veronica Strong, Johanna M. Swan | 2023-10-10 |
| 11769751 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2023-09-26 |
| 11764452 | Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity | Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan | 2023-09-19 |
| 11756943 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2023-09-12 |
| 11751367 | Microelectronic package electrostatic discharge (ESD) protection | Veronica Strong, Johanna M. Swan, Aleksandar Aleksov, Feras Eid | 2023-09-05 |
| 11749649 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Johanna M. Swan, Shawna M. Liff, Patrick Morrow, Gerald Pasdast, Van H. Le | 2023-09-05 |
| 11749642 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan | 2023-09-05 |
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Veronica Strong, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more | 2023-09-05 |
| 11728290 | Waveguide fan-out | Georgios Dogiamis, Johanna M. Swan, Aleksandar Aleksov, Telesphor Kamgaing, Henning Braunisch | 2023-08-15 |
| 11721649 | Microelectronic assemblies | Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller, Shawna M. Liff +2 more | 2023-08-08 |