Issued Patents All Time
Showing 101–125 of 261 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11509069 | Distributed on-package millimeter-wave radio | Telesphor Kamgaing | 2022-11-22 |
| 11494682 | Quantum computing assemblies | Shawna M. Liff, Jeanette M. Roberts, James S. Clarke | 2022-11-08 |
| 11482472 | Thermal management solutions for stacked integrated circuit devices | Feras Eid, Johanna M. Swan | 2022-10-25 |
| 11476554 | Mmwave waveguide to waveguide connectors for automotive applications | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Erich N. Ewy, Johanna M. Swan | 2022-10-18 |
| 11469206 | Microelectronic assemblies | Feras Eid, Johanna M. Swan, Shawna M. Lift | 2022-10-11 |
| 11469209 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2022-10-11 |
| 11462463 | Microelectronic assemblies having an integrated voltage regulator chiplet | Kaladhar Radhakrishnan, Krishna Bharath, Shawna M. Liff, Johanna M. Swan | 2022-10-04 |
| 11450560 | Microelectronic assemblies having magnetic core inductors | Krishna Bharath, Shawna M. Liff, Kaladhar Radhakrishnan, Zhiguo Qian, Johanna M. Swan | 2022-09-20 |
| 11437348 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan | 2022-09-06 |
| 11437693 | Mmwave waveguides featuring power-over-waveguide technology for automotive applications | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Kenneth D. Shoemaker, Erich N. Ewy +1 more | 2022-09-06 |
| 11424239 | Diodes for package substrate electrostatic discharge (ESD) protection | Aleksandar Aleksov, Feras Eid, Veronica Strong, Johanna M. Swan | 2022-08-23 |
| 11417593 | Dies with integrated voltage regulators | Krishna Bharath, Shawna M. Liff, Johanna M. Swan | 2022-08-16 |
| 11417586 | Thermal management solutions for substrates in integrated circuit packages | Feras Eid, Johanna M. Swan | 2022-08-16 |
| 11394094 | Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements | Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis, Shawna M. Liff, Aleksandar Aleksov +2 more | 2022-07-19 |
| 11393777 | Microelectronic assemblies | Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller, Shawna M. Liff +2 more | 2022-07-19 |
| 11393766 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati | 2022-07-19 |
| 11367707 | Semiconductor package or structure with dual-sided interposers and memory | Shawna M. Liff, Johanna M. Swan, Gerald Pasdast | 2022-06-21 |
| 11367689 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan | 2022-06-21 |
| 11348912 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar | 2022-05-31 |
| 11348897 | Microelectronic assemblies | Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more | 2022-05-31 |
| 11348895 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar | 2022-05-31 |
| 11348882 | Package spark gap structure | Aleksandar Aleksov, Feras Eid, Johanna M. Swan, Veronica Strong | 2022-05-31 |
| 11342320 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar | 2022-05-24 |
| 11342305 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Lift, Johanna M. Swan | 2022-05-24 |
| 11342243 | Thermal management solutions for embedded integrated circuit devices | Feras Eid, Johanna M. Swan | 2022-05-24 |