Issued Patents All Time
Showing 151–175 of 261 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183477 | Mixed hybrid bonding structures and methods of forming the same | Shawna M. Liff, Johanna M. Swan, Nagatoshi Tsunoda, Jimin Yao | 2021-11-23 |
| 11177912 | Quantum circuit assemblies with on-chip demultiplexers | Javier A. Falcon, Lester Lampert | 2021-11-16 |
| 11147197 | Microelectronic package electrostatic discharge (ESD) protection | Veronica Strong, Johanna M. Swan, Aleksandar Aleksov, Feras Eid | 2021-10-12 |
| 11094672 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Johanna M. Swan, Shawna M. Liff, Patrick Morrow, Gerald Pasdast, Van H. Le | 2021-08-17 |
| 11095012 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Shawna M. Liff +3 more | 2021-08-17 |
| 11049791 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Johanna M. Swan, Jimin Yao, Veronica Strong | 2021-06-29 |
| 11037892 | Substrate dielectric waveguides in semiconductor packages | Vijay K. Nair, Sasha N. Oster, Johanna M. Swan, Telesphor Kamgaing, Georgios Dogiamis | 2021-06-15 |
| 11031666 | Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric | Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Shawna M. Liff, Aleksandar Aleksov +3 more | 2021-06-08 |
| 11024933 | Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer | Brandon M. Rawlings, Shawna M. Liff, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing +3 more | 2021-06-01 |
| 11004824 | Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same | Henning Braunisch, Javier Soto Gonzalez, Shawna M. Liff | 2021-05-11 |
| 10998302 | Packaged device with a chiplet comprising memory resources | Van H. Le, Johanna M. Swan, Shawna M. Liff, Patrick Morrow, Gerald Pasdast +1 more | 2021-05-04 |
| 10992021 | Cross talk and interference reduction for high frequency wireless interconnects | Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis | 2021-04-27 |
| 10971453 | Semiconductor packaging with high density interconnects | Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more | 2021-04-06 |
| 10971416 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Mihir K. Roy, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more | 2021-04-06 |
| 10964992 | Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide | Georgios Dogiamis, Henning Braunisch, Gilbert Dewey, Telesphor Kamgaing, Hyung-Jin Lee +1 more | 2021-03-30 |
| 10959633 | Wearable sensing patch technologies | Amit S. Baxi, Vincent S. Mageshkumar, Sasha N. Oster, Aleksandar Aleksov, Feras Eid | 2021-03-30 |
| 10950919 | System comprising first and second servers interconnected by a plurality of joined waveguide sections | Telesphor Kamgaing, Georgios Dogiamis, Sasha N. Oster, Brandon M. Rawlings, Aleksandar Aleksov +3 more | 2021-03-16 |
| 10943851 | Reconstituted wafer assembly | Shawna M. Liff, Henning Braunisch, Johanna M. Swan | 2021-03-09 |
| 10921524 | Crimped mm-wave waveguide tap connector | Georgios Dogiamis, Sasha N. Oster, Erich N. Ewy, Telesphor Kamgaing, Johanna M. Swan | 2021-02-16 |
| 10921349 | Piezoelectric package-integrated current sensing devices | Georgios Dogiamis, Shawna M. Liff, Johanna M. Swan, Jelena Culic-Viskota, Thomas L. Sounart +2 more | 2021-02-16 |
| 10903818 | Piezoelectric package-integrated film bulk acoustic resonator devices | Vijay K. Nair, Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Valluri Rao +1 more | 2021-01-26 |
| 10897238 | Piezoelectric package-integrated contour mode filter devices | Feras Eid, Georgios Dogiamis, Valluri Rao, Johanna M. Swan, Telesphor Kamgaing +1 more | 2021-01-19 |
| 10868366 | Package architecture for antenna arrays | Shawna M. Liff, William J. Lambert | 2020-12-15 |
| 10852495 | Microelectronic package communication using radio interfaces connected through wiring | Shawna M. Liff, Telesphor Kamgaing, Sasha N. Oster, Gaurav Chawla | 2020-12-01 |
| 10854548 | Inter-die passive interconnects approaching monolithic performance | Zuoguo Wu, Debendra Das Sharma, Gerald Pasdast | 2020-12-01 |