Issued Patents All Time
Showing 126–150 of 261 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335642 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2022-05-17 |
| 11335663 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar | 2022-05-17 |
| 11335665 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2022-05-17 |
| 11336559 | Fast-lane routing for multi-chip packages | Tejpal Singh, Shawna M. Liff, Gerald Pasdast, Johanna M. Swan | 2022-05-17 |
| 11329359 | Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities | Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan | 2022-05-10 |
| 11329358 | Low loss and low cross talk transmission lines having l-shaped cross sections | Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2022-05-10 |
| 11309619 | Waveguide coupling systems and methods | Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Shawna M. Liff, Aleksandar Aleksov +1 more | 2022-04-19 |
| 11302599 | Heat dissipation device having a thermally conductive structure and a thermal isolation structure in the thermally conductive structure | Feras Eid, Johanna M. Swan | 2022-04-12 |
| 11296040 | Electrostatic discharge protection in integrated circuits | Feras Eid, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong | 2022-04-05 |
| 11296052 | TSV-less die stacking using plated pillars/through mold interconnect | Preston T. Meyers, Javier A. Falcon, Shawna M. Liff, Joe Saucedo, Albert S. Lopez +1 more | 2022-04-05 |
| 11289431 | Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity | Feras Eid, Veronica Strong, Aleksandar Aleksov, Johanna M. Swan | 2022-03-29 |
| 11282812 | Thermal management solutions for stacked integrated circuit devices using jumping drops vapor chambers | Feras Eid, Johanna M. Swan | 2022-03-22 |
| 11270947 | Composite interposer structure and method of providing same | Shawna M. Liff, Johanna M. Swan, Gerald Pasdast | 2022-03-08 |
| 11264687 | Microelectronic assemblies comprising a package substrate portion integrated with a substrate integrated waveguide filter | Georgios Dogiamis | 2022-03-01 |
| 11264373 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Feras Eid, Veronica Strong, Johanna M. Swan | 2022-03-01 |
| 11239155 | Conductive contact structures for electrostatic discharge protection in integrated circuits | Feras Eid, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong | 2022-02-01 |
| 11234343 | Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices | Feras Eid, Johanna M. Swan | 2022-01-25 |
| 11227825 | High performance integrated RF passives using dual lithography process | Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman, Aleksandar Aleksov +6 more | 2022-01-18 |
| 11226162 | Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections | Feras Eid, Johanna M. Swan | 2022-01-18 |
| 11222856 | Package-integrated bistable switch for electrostatic discharge (ESD) protection | Feras Eid, Veronica Strong, Aleksandar Aleksov, Johanna M. Swan | 2022-01-11 |
| 11223524 | Package integrated security features | Shawna M. Liff, Sasha N. Oster, Feras Eid, Georgios Dogiamis, Thomas L. Sounart +1 more | 2022-01-11 |
| 11217535 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan | 2022-01-04 |
| 11205630 | Vias in composite IC chip structures | Patrick Morrow, Johanna M. Swan, Shawna M. Liff, Mauro Kobrinksy, Van H. Le +1 more | 2021-12-21 |
| 11189585 | Selective recess of interconnects for probing hybrid bond devices | Brennen Mueller, Mauro J. Kobrinsky, Johanna M. Swan, Shawna M. Liff, Pooya Tadayon | 2021-11-30 |
| 11189580 | Electrostatic discharge protection in integrated circuits | Krishna Bharath, Feras Eid, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong | 2021-11-30 |