Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694986 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Shawna M. Liff, Van H. Le +1 more | 2023-07-04 |
| 11205630 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Shawna M. Liff, Van H. Le +1 more | 2021-12-21 |