Issued Patents All Time
Showing 76–100 of 261 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11716826 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Henning Braunisch, Aleksandar Aleksov +1 more | 2023-08-01 |
| 11715693 | Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture | Georgios Dogiamis, Aleksandar Aleksov, Henning Braunisch, Johanna M. Swan, Telesphor Kamgaing | 2023-08-01 |
| 11694986 | Vias in composite IC chip structures | Patrick Morrow, Johanna M. Swan, Shawna M. Liff, Mauro Kobrinksy, Van H. Le +1 more | 2023-07-04 |
| 11688729 | Integrated thin film capacitors on a glass core substrate | Krishna Bharath, Mathew J. Manusharow | 2023-06-27 |
| 11688665 | Thermal management solutions for stacked integrated circuit devices | Feras Eid, Johanna M. Swan | 2023-06-27 |
| 11676918 | Electrostatic discharge protection in integrated circuits | Feras Eid, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong | 2023-06-13 |
| 11652264 | Microelectronic assemblies with substrate integrated waveguide | Georgios Dogiamis | 2023-05-16 |
| 11652059 | Composite interposer structure and method of providing same | Shawna M. Lift, Johanna M. Swan, Gerald Pasdast | 2023-05-16 |
| 11621236 | Electrostatic discharge protection in integrated circuits using positive temperature coefficient material | Feras Eid, Veronica Strong, Aleksandar Aleksov, Johanna M. Swan | 2023-04-04 |
| 11621208 | Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices | Feras Eid, Johanna M. Swan | 2023-04-04 |
| 11616047 | Microelectronic assemblies | Feras Eid, Johanna M. Swan, Shawna M. Liff | 2023-03-28 |
| 11615998 | Thermal management solutions for embedded integrated circuit devices | Johanna M. Swan, Feras Eid | 2023-03-28 |
| 11605603 | Microelectronic package with radio frequency (RF) chiplet | Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan, Shawna M. Liff +1 more | 2023-03-14 |
| 11600594 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar | 2023-03-07 |
| 11594801 | Mmwave dielectric waveguide interconnect topology for automotive applications | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Erich N. Ewy, Kenneth D. Shoemaker +1 more | 2023-02-28 |
| 11581282 | Serializer-deserializer die for high speed signal interconnect | Johanna M. Swan, Shawna M. Liff, Gerald Pasdast | 2023-02-14 |
| 11581272 | Contactless high-frequency interconnect | Henning Braunisch, Georgios Dogiamis, Telesphor Kamgaing, Richard J. Dischler, Johanna M. Swan +1 more | 2023-02-14 |
| 11581238 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Johanna M. Swan, Jimin Yao, Veronica Strong | 2023-02-14 |
| 11575749 | Low-weight single mm-wave dielectric waveguide interconnect architecture in autonomous cars | Georgios Dogiamis, Sasha N. Oster, Erich N. Ewy, Johanna M. Swan, Telesphor Kamgaing | 2023-02-07 |
| 11569428 | Superconducting qubit device packages | Jeanette M. Roberts, Shawna M. Liff, Johanna M. Swan, Roman Caudillo, Zachary R. Yoscovits +4 more | 2023-01-31 |
| 11562971 | Semiconductor packages with antennas | Telesphor Kamgaing, Sasha N. Oster | 2023-01-24 |
| 11538617 | Integrated magnetic core inductors on glass core substrates | Krishna Bharath | 2022-12-27 |
| 11525970 | Microelectronic package communication using radio interfaces connected through wiring | Shawna M. Liff, Telesphor Kamgaing, Sasha N. Oster, Gaurav Chawla | 2022-12-13 |
| 11527501 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Veronica Strong, Shawna M. Liff, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more | 2022-12-13 |
| 11508587 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2022-11-22 |