Issued Patents All Time
Showing 26–50 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728290 | Waveguide fan-out | Adel A. Elsherbini, Georgios Dogiamis, Johanna M. Swan, Aleksandar Aleksov, Telesphor Kamgaing | 2023-08-15 |
| 11721649 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Kimin Jun, Brennen Mueller, Shawna M. Liff +2 more | 2023-08-08 |
| 11716826 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2023-08-01 |
| 11715693 | Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture | Georgios Dogiamis, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan, Telesphor Kamgaing | 2023-08-01 |
| 11664303 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2023-05-30 |
| 11605603 | Microelectronic package with radio frequency (RF) chiplet | Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan, Shawna M. Liff +1 more | 2023-03-14 |
| 11581272 | Contactless high-frequency interconnect | Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Richard J. Dischler, Johanna M. Swan +1 more | 2023-02-14 |
| 11495552 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Prithwish Chatterjee, Andrew J. Brown | 2022-11-08 |
| 11460499 | Dual sided thermal management solutions for integrated circuit packages | Aleksandar Aleksov, Veronica Strong, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2022-10-04 |
| 11393777 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Kimin Jun, Brennen Mueller, Shawna M. Liff +2 more | 2022-07-19 |
| 11387188 | High density interconnect structures configured for manufacturing and performance | Kemal Aygun, Ajay Jain, Zhiguo Qian | 2022-07-12 |
| 11387187 | Embedded very high density (VHD) layer | Andrew Collins, Jianyong Xie, Sujit Sharan, Aleksandar Aleksov | 2022-07-12 |
| 11380624 | Electromagnetic interference shield created on package using high throughput additive manufacturing | Feras Eid, Shawna M. Liff, Georgios Dogiamis, Johanna M. Swan | 2022-07-05 |
| 11348897 | Microelectronic assemblies | Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more | 2022-05-31 |
| 11329359 | Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities | Georgios Dogiamis, Adel A. Elsherbini, Telesphor Kamgaing, Johanna M. Swan | 2022-05-10 |
| 11329358 | Low loss and low cross talk transmission lines having l-shaped cross sections | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2022-05-10 |
| 11282800 | Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials | Feras Eid, Georgios Dogiamis | 2022-03-22 |
| 11222847 | Enabling long interconnect bridges | Ravindranath V. Mahajan, Zhiguo Qian, Kemal Aygun, Sujit Sharan | 2022-01-11 |
| 11133263 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2021-09-28 |
| 11108433 | Single side band transmission over a waveguide | Georgios Dogiamis, Jeff C. Morriss, Hyung-Jin Lee, Richard J. Dischler, Ajay Balankutty +2 more | 2021-08-31 |
| 11101205 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2021-08-24 |
| 11004824 | Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same | Adel A. Elsherbini, Javier Soto Gonzalez, Shawna M. Liff | 2021-05-11 |
| 10998272 | Organic interposers for integrated circuit packages | Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong, Johanna M. Swan | 2021-05-04 |
| 10992342 | Simplified multimode signaling techniques | Yidnekachew S. Mekonnen, Kemal Aygun | 2021-04-27 |
| 10971453 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Krishna Bharath, Javier Soto Gonzalez +1 more | 2021-04-06 |