Issued Patents All Time
Showing 51–75 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964992 | Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide | Georgios Dogiamis, Adel A. Elsherbini, Gilbert Dewey, Telesphor Kamgaing, Hyung-Jin Lee +1 more | 2021-03-30 |
| 10943851 | Reconstituted wafer assembly | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan | 2021-03-09 |
| 10923429 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2021-02-16 |
| 10867926 | High density interconnect structures configured for manufacturing and performance | Kemal Aygun, Ajay Jain, Zhiguo Qian | 2020-12-15 |
| 10845380 | Microelectronic devices for isolating drive and sense signals of sensing devices | Feras Eid, Georgios Dogiamis, Sasha N. Oster | 2020-11-24 |
| 10845552 | Coreless package architecture for multi-chip opto-electronics | Shawna M. Liff, Timothy A. Gosselin, Prasanna Raghavan, Yikang Deng, Zhiguo Qian | 2020-11-24 |
| 10833020 | High density interconnect structures configured for manufacturing and performance | Kemal Aygun, Ajay Jain, Zhiguo Qian | 2020-11-10 |
| 10819445 | Waveguide and transceiver interference mitigation | Telesphor Kamgaing, Georgios Dogiamis, Hyung-Jin Lee, Richard J. Dischler | 2020-10-27 |
| 10763216 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2020-09-01 |
| 10734236 | Electronic devices with components formed by late binding using self-assembled monolayers | Sasha N. Oster, Fay Hua, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan | 2020-08-04 |
| 10651525 | Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2020-05-12 |
| 10645813 | Zero-misalignment via-pad structures | Brandon M. Rawlings | 2020-05-05 |
| 10623106 | Orthogonal frequency division multiplexing single sideband transmission over a waveguide | Hyung-Jin Lee, Cho-Ying Lu, Telesphor Kamgaing, Georgios Dogiamis, Richard J. Dischler | 2020-04-14 |
| 10510669 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2019-12-17 |
| 10475736 | Via architecture for increased density interface | Aleksandar Aleksov, Arnab Sarkar, Arghya Sain, Kristof Darmawikarta, Prashant Parmar +3 more | 2019-11-12 |
| 10381291 | Lithographacally defined vias for organic package substrate scaling | Adel A. Elsherbini, Brandon M. Rawlings, Aleksandar Aleksov, Feras Eid, Javier Soto | 2019-08-13 |
| 10361142 | Dual-sided die packages | Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Don Nelson | 2019-07-23 |
| 10304686 | Electronic devices with components formed by late binding using self-assembled monolayers | Sasha N. Oster, Fay Hua, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan | 2019-05-28 |
| 10186465 | Package-integrated microchannels | Feras Eid, Adel A. Elsherbini, Yidnekachew S. Mekonnen, Krishna Bharath, Mathew J. Manusharow +2 more | 2019-01-22 |
| 10187998 | Zero-misalignment via-pad structures | Brandon M. Rawlings | 2019-01-22 |
| 10054737 | Optical I/O system using planar light-wave integrated circuit | Mauro J. Kobrinsky, Shawna M. Liff, Peter L. D. Chang, Bruce A. Block, Johanna M. Swan | 2018-08-21 |
| 9992859 | Low loss and low cross talk transmission lines using shaped vias | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2018-06-05 |
| 9875969 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan, Sujit Sharan | 2018-01-23 |
| 9713264 | Zero-misalignment via-pad structures | Brandon M. Rawlings | 2017-07-18 |
| 9711428 | Dual-sided die packages | Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Don Nelson | 2017-07-18 |