Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power delivery for embedded bridge die utilizing trench structures

Power delivery for embedded bridge die utilizing trench structures

US Patent 12062616 · Granted Aug 13, 2024

Estimated economic value: $26,861,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Centrifugal fan, neck fan, and vortex shell assembly2025
Centrifugal fan, neck fan, and vortex shell assembly2025
Neck fan2025
Ground via clustering for crosstalk mitigation2025
Ground via clustering for crosstalk mitigation2025
Heterogenous socket contact for electrical and mechanical performance scaling in2025
Glass substrates having signal shielding for use with semiconductor packages and2025
Glass substrates having signal shielding for use with semiconductor packages and2025
Substrateless double-sided embedded multi-die interconnect bridge2025
Through-substrate optical vias2025
Capacitors and resistors at direct bonding interfaces in microelectronic assembl2025
Airgap structures for high speed signal integrity2025