Issued Patents All Time
Showing 26–50 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387188 | High density interconnect structures configured for manufacturing and performance | Henning Braunisch, Kemal Aygun, Ajay Jain | 2022-07-12 |
| 11296031 | Dielectric-filled trench isolation of vias | Kemal Aygun, Jianyong Xie | 2022-04-05 |
| 11276635 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie | 2022-03-15 |
| 11244890 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2022-02-08 |
| 11222847 | Enabling long interconnect bridges | Ravindranath V. Mahajan, Henning Braunisch, Kemal Aygun, Sujit Sharan | 2022-01-11 |
| 11222848 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Jianyong Xie | 2022-01-11 |
| 11094633 | Bridge die design for high bandwidth memory interface | Kemal Aygun, Dae-Woo Kim, Jackie C. Preciado | 2021-08-17 |
| 11081434 | Package substrates with magnetic build-up layers | Kaladhar Radhakrishnan, Kemal Aygun | 2021-08-03 |
| 11031341 | Side mounted interconnect bridges | Md Altai Hossain, Kevin J. Doran, Yu Zhang | 2021-06-08 |
| 10950550 | Semiconductor package with through bridge die connections | Jianyong Xie, Kemal Aygun | 2021-03-16 |
| 10892225 | Die interconnect structures and methods | Kemal Aygun | 2021-01-12 |
| 10867926 | High density interconnect structures configured for manufacturing and performance | Henning Braunisch, Kemal Aygun, Ajay Jain | 2020-12-15 |
| 10854539 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2020-12-01 |
| 10845552 | Coreless package architecture for multi-chip opto-electronics | Shawna M. Liff, Henning Braunisch, Timothy A. Gosselin, Prasanna Raghavan, Yikang Deng | 2020-11-24 |
| 10840196 | Trace modulations in connectors for integrated-circuit packages | Cemil Geyik | 2020-11-17 |
| 10833020 | High density interconnect structures configured for manufacturing and performance | Henning Braunisch, Kemal Aygun, Ajay Jain | 2020-11-10 |
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Wilfred Gomes, Yu Zhang +7 more | 2020-09-22 |
| 10748842 | Package substrates with magnetic build-up layers | Kaladhar Radhakrishnan, Kemal Aygun | 2020-08-18 |
| 10746780 | High power terahertz impulse for fault isolation | Mayue Xie, Simranjit S. Khalsa, Hemachandar Tanukonda Devarajulu, Deepak Goyal | 2020-08-18 |
| 10692847 | Inorganic interposer for multi-chip packaging | Daniel N. Sobieski, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Merve Celikkol, Kyu Oh Lee +1 more | 2020-06-23 |
| 10658279 | High density package interconnects | Sanka Ganesan, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2020-05-19 |
| 10607951 | Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices | Yu Zhang, Gabriel Regalado Silva, Kemal Aygun | 2020-03-31 |
| 10580734 | Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices | Yu Zhang, Gabriel Regalado Silva, Kemal Aygun | 2020-03-03 |
| 10396022 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2019-08-27 |
| 10396036 | Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices | Yu Zhang, Kemal Aygun, Yidnekachew S. Mekonnen, Gregorio R. Murtagian, Sanka Ganesan +2 more | 2019-08-27 |