Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10692847 | Inorganic interposer for multi-chip packaging | Daniel N. Sobieski, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Kyu Oh Lee, Kemal Aygun +1 more | 2020-06-23 | $27,746,000 |