Issued Patents All Time
Showing 51–72 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10317932 | Capacitive structures for crosstalk reduction | Zhichao Zhang, Xiang Li, Kemal Aygun, Tolga Memioglu | 2019-06-11 |
| 10283453 | Interconnect routing configurations and associated techniques | Kemal Aygun, Dae-Woo Kim | 2019-05-07 |
| 10204851 | High density package interconnects | Sanka Ganesan, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2019-02-12 |
| 10103054 | Coupled vias for channel cross-talk reduction | Zhichao Zhang, Tolga Memioglu, Kemal Aygun | 2018-10-16 |
| 10088518 | Apparatus and method for classifying and locating electrical faults in circuitry | Mayue Xie, Jong-Ru Guo, Zhichao Zhang, Zuoguo Wu | 2018-10-02 |
| 10056528 | Interposer structures, semiconductor assembly and methods for forming interposer structures | Kemal Aygun | 2018-08-21 |
| 10026682 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2018-07-17 |
| 10008451 | Bridge interconnect with air gap in package assembly | Chia-Pin Chiu, Mathew J. Manusharow | 2018-06-26 |
| 9922916 | High density package interconnects | Sanka Ganesan, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2018-03-20 |
| 9806011 | Non-uniform substrate stackup | Zhichao Zhang, Tao Wu, Kemal Aygun | 2017-10-31 |
| 9622339 | Routing design for high speed input/output links | Kemal Aygun | 2017-04-11 |
| 9589866 | Bridge interconnect with air gap in package assembly | Chia-Pin Chiu, Mathew J. Manusharow | 2017-03-07 |
| 9548734 | Smart impedance matching for high-speed I/O | Hongjiang Song, Yan Song, Zhichao Zhang | 2017-01-17 |
| 9542522 | Interconnect routing configurations and associated techniques | Kemal Aygun, Dae-Woo Kim | 2017-01-10 |
| 9515017 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2016-12-06 |
| 9368437 | High density package interconnects | Sanka Ganesan, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2016-06-14 |
| 9275971 | Bridge interconnect with air gap in package assembly | Chia-Pin Chiu, Mathew J. Manusharow | 2016-03-01 |
| 9240377 | X-line routing for dense multi-chip-package interconnects | Kemal Aygun | 2016-01-19 |
| 9232639 | Non-uniform substrate stackup | Zhichao Zhang, Tao Wu, Kemal Aygun | 2016-01-05 |
| 9230900 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2016-01-05 |
| 8946900 | X-line routing for dense multi-chip-package interconnects | Kemal Aygun | 2015-02-03 |
| 8872349 | Bridge interconnect with air gap in package assembly | Chia-Pin Chiu, Mathew J. Manusharow | 2014-10-28 |