Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Optimal signal routing performance through dielectric material configuration designs in package substrate

Optimal signal routing performance through dielectric material configuration designs in package substrate

US Patent 11574862 · Granted Feb 7, 2023

Estimated economic value: $11,877,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ground via clustering for crosstalk mitigation2025
Ground via clustering for crosstalk mitigation2025
Solder interconnect hierarchy for heterogeneous electronic device packaging2025
Angle-adjustable folding bed2025
First layer interconnect first on carrier approach for EMIB patch2025
Vertically integrated automatic threat level determination for containers and ho2025
Microelectronic assemblies including interconnects with different solder materia2025
Heterogenous socket contact for electrical and mechanical performance scaling in2025
Device and method for improved fiducial marker detection2025
Omni directional interconnect with magnetic fillers in mold matrix2025
First layer interconnect first on carrier approach for EMIB patch2025
Glass substrates having signal shielding for use with semiconductor packages and2025