Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Die interconnect structures having bump field and ground plane

Die interconnect structures having bump field and ground plane

US Patent 11923308 · Granted Mar 5, 2024

Estimated economic value: $29,696,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ground via clustering for crosstalk mitigation2025
Ground via clustering for crosstalk mitigation2025
Heterogenous socket contact for electrical and mechanical performance scaling in2025
Glass substrates having signal shielding for use with semiconductor packages and2025
Glass substrates having signal shielding for use with semiconductor packages and2025
Through-substrate optical vias2025
Capacitors and resistors at direct bonding interfaces in microelectronic assembl2025
Airgap structures for high speed signal integrity2025
Scalable and interoperable PHYLESS die-to-die IO solution2024
Optical multichip package with multiple system-on-chip dies2024
Minimizing package impedance discontinuity through dielectric structure optimiza2024
Minimizing package impedance discontinuity through dielectric structure optimiza2024