Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias

Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias

US Patent 11688692 · Granted Jun 27, 2023

Estimated economic value: $18,721,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for cloud based root service application across multiple coo2025
Microelectronic assemblies including interconnects with different solder materia2025
Organic passivation for fine pitch architectures2025
Lithographic cavity formation to enable EMIB bump pitch scaling2025
First layer interconnect first on carrier approach for EMIB patch2025
Lithographic cavity formation to enable EMIB bump pitch scaling2025
Catheter deflection system with deflection load limiter2025
Die interconnect substrate, an electrical device and a method for forming a die 2025
Magneto-optical Kerr effect interconnects for photonic packaging2025
Multi-chip package with high density interconnects2025
Panel level packaging for multi-die products interconnected with very high densi2025
Integrated circuit package supports2024