Issued Patents All Time
Showing 51–75 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804650 | Electrical connector having offset contacts for minimizing or cancelling crosstalk | Jeffrey Lee, Brent R. Rothermel | 2020-10-13 |
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes, Yu Zhang +7 more | 2020-09-22 |
| 10748842 | Package substrates with magnetic build-up layers | Zhiguo Qian, Kaladhar Radhakrishnan | 2020-08-18 |
| 10716231 | Pin count socket having reduced pin count and pattern transformation | Srikant Nekkanty, Zhichao Zhang | 2020-07-14 |
| 10692847 | Inorganic interposer for multi-chip packaging | Daniel N. Sobieski, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Merve Celikkol, Kyu Oh Lee +1 more | 2020-06-23 |
| 10607951 | Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices | Yu Zhang, Gabriel Regalado Silva, Zhiguo Qian | 2020-03-31 |
| 10580734 | Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices | Yu Zhang, Gabriel Regalado Silva, Zhiguo Qian | 2020-03-03 |
| 10510667 | Conductive coating for a microelectronics package | Li-Sheng Weng, Chung-Hao Chen, Emile Davies-Venn, Mitul Modi | 2019-12-17 |
| 10453795 | Microprocessor package with first level die bump ground webbing structure | Yu Zhang, Mathew J. Manusharow, Mohiuddin M. Mazumder | 2019-10-22 |
| 10416378 | Chip-to-chip interconnect with embedded electro-optical bridge structures | Zhichao Zhang, Robert L. Sankman | 2019-09-17 |
| 10396022 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2019-08-27 |
| 10396036 | Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices | Yu Zhang, Zhiguo Qian, Yidnekachew S. Mekonnen, Gregorio R. Murtagian, Sanka Ganesan +2 more | 2019-08-27 |
| 10375832 | Method of forming an interference shield on a substrate | Digvijay A. Raorane, Daniel N. Sobieski, Drew W. Delaney | 2019-08-06 |
| 10317932 | Capacitive structures for crosstalk reduction | Zhichao Zhang, Xiang Li, Zhiguo Qian, Tolga Memioglu | 2019-06-11 |
| 10303225 | Methods of forming hybrid socket structures for package interconnect applications and structures formed thereby | Zhichao Zhang, Cemil Geyik, Guneet Kaur | 2019-05-28 |
| 10283453 | Interconnect routing configurations and associated techniques | Zhiguo Qian, Dae-Woo Kim | 2019-05-07 |
| 10205292 | Socket contact techniques and configurations | Dhanya Athreya, Gaurav Chawla, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley +3 more | 2019-02-12 |
| 10103054 | Coupled vias for channel cross-talk reduction | Zhichao Zhang, Zhiguo Qian, Tolga Memioglu | 2018-10-16 |
| 10056528 | Interposer structures, semiconductor assembly and methods for forming interposer structures | Zhiguo Qian | 2018-08-21 |
| 10026682 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2018-07-17 |
| 9971089 | Chip-to-chip interconnect with embedded electro-optical bridge structures | Zhichao Zhang, Robert L. Sankman | 2018-05-15 |
| 9935063 | Rlink-on-die inductor structures to improve signaling | Yu Zhang, Jihwan Kim, Ajay Balankutty, Anupriya Sriramulu, Md. Mohiuddin Mazumder +2 more | 2018-04-03 |
| 9922751 | Helically insulated twinax cable systems and methods | Zhichao Zhang, Gong Ouyang, Kai Xiao, Eric J. Li | 2018-03-20 |
| 9894752 | Inductors for circuit board through hole structures | Zhichao Zhang, Gong Ouyang, Kai Xiao, Beom-Taek Lee | 2018-02-13 |
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2017-12-12 |