Issued Patents All Time
Showing 76–100 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more | 2017-11-14 |
| 9806011 | Non-uniform substrate stackup | Zhichao Zhang, Tao Wu, Zhiguo Qian | 2017-10-31 |
| 9807866 | Shielding mold for electric and magnetic EMI mitigation | Zhichao Zhang, Adel A. Elsherbini, Robert L. Sankman | 2017-10-31 |
| 9780510 | Socket contact techniques and configurations | Dhanya Athreya, Gaurav Chawla, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley +3 more | 2017-10-03 |
| 9622339 | Routing design for high speed input/output links | Zhiguo Qian | 2017-04-11 |
| 9564407 | Crosstalk polarity reversal and cancellation through substrate material | Zhichao Zhang, Tolga Memioglu, Tao Wu | 2017-02-07 |
| 9542522 | Interconnect routing configurations and associated techniques | Zhiguo Qian, Dae-Woo Kim | 2017-01-10 |
| 9515031 | Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects | Nevin Altunyurt, Kevin J. Doran, Yidnekachew S. Mekonnen | 2016-12-06 |
| 9515017 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2016-12-06 |
| 9478881 | Snap connector for socket assembly and associated techniques and configurations | Zhichao Zhang, Gaurav Chawla, Rajasekaran Swaminathan, Li Sun | 2016-10-25 |
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2016-07-19 |
| 9391018 | Crosstalk polarity reversal and cancellation through substrate material tuning | Zhichao Zhang, Tolga Memioglu, Tao Wu | 2016-07-12 |
| 9240377 | X-line routing for dense multi-chip-package interconnects | Zhiguo Qian | 2016-01-19 |
| 9230900 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2016-01-05 |
| 9232686 | Thin film based electromagnetic interference shielding with BBUL/coreless packages | Digvijay A. Raorane, Daniel N. Sobieski, Drew W. Delaney | 2016-01-05 |
| 9232639 | Non-uniform substrate stackup | Zhichao Zhang, Tao Wu, Zhiguo Qian | 2016-01-05 |
| 9105635 | Stubby pads for channel cross-talk reduction | Nevin Altunyurt, Tolga Memioglu | 2015-08-11 |
| 9069910 | Mechanism for facilitating dynamic cancellation of signal crosstalk in differential input/output channels | Zhichao Zhang, Khine Han | 2015-06-30 |
| 8946900 | X-line routing for dense multi-chip-package interconnects | Zhiguo Qian | 2015-02-03 |
| 8643184 | Crosstalk polarity reversal and cancellation through substrate material tuning | Zhichao Zhang, Tolga Memioglu, Tao Wu | 2014-02-04 |
| 8558636 | Package embedded equalizer | Jaemin Shin, Pascal A. Meier, Telesphor Kamgaing | 2013-10-15 |
| 8508947 | Flex cable and method for making the same | Sanka Ganesan, Mohiuddin M. Mazumder, Zhichao Zhang | 2013-08-13 |
| 8450201 | Multimode signaling on decoupled input/output and power channels | Henning Braunisch | 2013-05-28 |
| 8188594 | Input/output package architectures | Sanka Ganesan, Chandrashekhar Ramaswamy, Eric Palmer, Henning Braunisch | 2012-05-29 |
| 8025531 | Shielded socket housing | Zhichao Zhang, Joshua D. Heppner | 2011-09-27 |