Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11780210 | Glass dielectric layer with patterning | Jieying Kong, Srinivas V. Pietambaram, Patrick QUACH, Dilan Seneviratne | 2023-10-10 |
| 11769735 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2023-09-26 |
| 11756890 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Rahul N. Manepalli | 2023-09-12 |
| 11646274 | Multi-package assemblies having foam structures for warpage control | Mufei Yu, Edvin Cetegen, Baris Bicen, Rahul N. Manepalli | 2023-05-09 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Andrew J. Brown, Jeremy Ecton +1 more | 2023-04-04 |
| 11574862 | Optimal signal routing performance through dielectric material configuration designs in package substrate | Zhiguo Qian, Kemal Aygun, Jieying Kong | 2023-02-07 |
| 11527484 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Jesse C. Jones, Jason M. Gamba, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan | 2022-12-13 |
| 11521931 | Microelectronic structures including bridges | Jason M. Gamba, Nitin A. Deshpande, Mohit Bhatia, Omkar G. Karhade, Bai Nie +2 more | 2022-12-06 |
| 11355438 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Rahul N. Manepalli | 2022-06-07 |
| 11355961 | Method and system for fast reconfiguration of power supply network in tens of milliseconos after power grid failure | Xiaonan LOU, Qi Zhang, Yuhan Zhang, Nian Liu, Liangliang Zheng | 2022-06-07 |
| 11348718 | Substrate embedded magnetic core inductors and method of making | Srinivas V. Pietambaram, Kristof Darmawikarta, Yonggang Li, Sameer Paital | 2022-05-31 |
| 11232192 | Automatic deployment of application security policy using application manifest and dynamic process analysis in a containerization environment | Glen K. Kosaka, Fei Huang | 2022-01-25 |
| 11227849 | Electroless-catalyst doped-mold materials for integrated-circuit die packaging architectures | Brandon C. Marin, Srinivas V. Pietambaram, Kristof Darmawikarta, Sameer Paital | 2022-01-18 |
| 11106784 | Vertically integrated automatic threat level determination for containers and hosts in a containerization environment | Henrik Rosendahl, Fei Huang | 2021-08-31 |
| 11088103 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Steve Cho, Leonel Arana +1 more | 2021-08-10 |
| 11075884 | Network context monitoring within service mesh containerization environment | Yuncong Feng | 2021-07-27 |
| 11062933 | Die placement and coupling apparatus | Jesse C. Jones, Yosuke Kanaoka, Rahul N. Manepalli | 2021-07-13 |
| 10847471 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Jesse C. Jones, Jason M. Gamba, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan | 2020-11-24 |
| 10467043 | Transparent network security for application containers | — | 2019-11-05 |
| 10353726 | Transparent network security for application containers | — | 2019-07-16 |
| 10356127 | Methods and systems for applying security policies in a virtualization environment | Fei Huang | 2019-07-16 |
| 10341387 | Methods and systems for applying security policies in a virtualization environment using a security instance | Fei Huang | 2019-07-02 |
| 10284594 | Detecting and preventing flooding attacks in a network environment | Shaohong Wei, Zhong Qiang Chen, Bing Xie | 2019-05-07 |
| 10185638 | Creating additional security containers for transparent network security for application containers based on conditions | — | 2019-01-22 |
| 9973538 | Architecture of transparent network security for application containers | — | 2018-05-15 |