Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6700209 | Partial underfill for flip-chip electronic packages | George F. Raiser, Bob Sundahl | 2004-03-02 |
| 6490166 | Integrated circuit package having a substrate vent hole | Suresh Ramalingam, Nagesh Vodrahalli, Michael J. Costello, Mun Leong Loke | 2002-12-03 |
| 6365441 | Partial underfill for flip-chip electronic packages | George F. Raiser, Bob Sundahl | 2002-04-02 |
| 6239973 | EMI containment for microprocessor core mounted on a card using surface mounted clips | Scot W. Taylor, Robert Starkston, Charles A. Gealer, Michael Rutigliano, Raymond A. Krick +3 more | 2001-05-29 |
| 6191475 | Substrate for reducing electromagnetic interference and enclosure | Harry G. Skinner, Neil C. Delaplane, Robert Starkston, Mirng-Ji Lii, Ron Edsall | 2001-02-20 |
| 6173489 | "Organic substrate (PCB) slip plane ""stress deflector"" for flip chip devices" | John F. McMahon | 2001-01-16 |
| 6043983 | EMI containment for microprocessor core mounted on a card using surface mounted clips | Scot W. Taylor, Robert Starkston, Charles A. Gealer, Michael Rutigliano, Raymond A. Krick +3 more | 2000-03-28 |
| 6011696 | Cartridge and an enclosure for a semiconductor package | Hong Xie, Neil C. Delaplane, Gregory A. James | 2000-01-04 |
| 5936304 | C4 package die backside coating | Mirng-Ji Lii, George F. Raiser, Brad Menzies | 1999-08-10 |
| 5804771 | "Organic substrate (PCB) slip plane ""stress deflector"" for flip chip deivces" | John F. McMahon | 1998-09-08 |