Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5722162 | Fabrication procedure for a stable post | William T. Chou, Solomon I. Beilin, David A. Horine, David Kudzuma, Michael G. Lee +1 more | 1998-03-03 |
| 5655290 | Method for making a three-dimensional multichip module | David A. Horine, Wen-chou Vincent Wang | 1997-08-12 |
| 5536362 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, William T. Chou, David A. Horine, Connie M. Wong, Solomon I. Beilin | 1996-07-16 |
| 5514906 | Apparatus for cooling semiconductor chips in multichip modules | David G. Love, David A. Horine, Wen-chou Vincent Wang, Richard L. Wheeler, Patricia R. Boucher +1 more | 1996-05-07 |
| 5426563 | Three-dimensional multichip module | David A. Horine, Wen-chou Vincent Wang | 1995-06-20 |
| 5404265 | Interconnect capacitors | David G. Love, Wen-chou Vincent Wang | 1995-04-04 |
| 5334804 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, William T. Chou, David A. Horine, Connie M. Wong, Solomon I. Beilin | 1994-08-02 |