Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7319051 | Thermally enhanced metal capped BGA package | Eng-Chew Cheah | 2008-01-15 |
| 7144756 | Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate | Wen-chou Vincent Wang, Yuan-Liang Li | 2006-12-05 |
| 6969636 | Semiconductor package with stress inhibiting intermediate mounting substrate | — | 2005-11-29 |
| 6909176 | Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate | Wen-chou Vincent Wang, Yuan-Liang Li | 2005-06-21 |
| 6882041 | Thermally enhanced metal capped BGA package | Eng-Chew Cheah | 2005-04-19 |
| 6734540 | Semiconductor package with stress inhibiting intermediate mounting substrate | — | 2004-05-11 |
| 5757070 | Integrated circuit package | — | 1998-05-26 |
| 5744383 | Integrated circuit package fabrication method | — | 1998-04-28 |
| 5723869 | Multichannel position sensing detector | Pat V. Costa, William E. Yonescu | 1998-03-03 |
| 5554858 | Segmented position sensing detector for reducing non-uniformly distributed stray light from a spot image | Pat V. Costa, William E. Yonescu | 1996-09-10 |