Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7319051 | Thermally enhanced metal capped BGA package | Donald S. Fritz | 2008-01-15 |
| 7199477 | Multi-tiered lead package for an integrated circuit | — | 2007-04-03 |
| 6894229 | Mechanically enhanced package and method of making same | — | 2005-05-17 |
| 6882041 | Thermally enhanced metal capped BGA package | Donald S. Fritz | 2005-04-19 |
| 6858942 | Semiconductor package with improved thermal cycling performance, and method of forming same | SYDNEY ANDERSON | 2005-02-22 |
| 6818968 | Integrated circuit package and process for forming the same | — | 2004-11-16 |
| 6627517 | Semiconductor package with improved thermal cycling performance, and method of forming same | Sidney Larry Anderson | 2003-09-30 |