Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6929978 | Method of fabricating an integrated circuit package utilizing a conductive structure for improving the bond strength between an IC package and a printed circuit board | — | 2005-08-16 |
| 6627517 | Semiconductor package with improved thermal cycling performance, and method of forming same | Eng-Chew Cheah | 2003-09-30 |
| 6462414 | Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball pad | — | 2002-10-08 |