Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Mechanically enhanced package and method of making same

Mechanically enhanced package and method of making same

US Patent 6894229 · Granted May 17, 2005

Estimated economic value: $20,313,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermally enhanced metal capped BGA package2008
Multi-tiered lead package for an integrated circuit2007
Thermally enhanced metal capped BGA package2005
Semiconductor package with improved thermal cycling performance, and method of f2005
Integrated circuit package and process for forming the same2004
Semiconductor package with improved thermal cycling performance, and method of f2003