Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6389686 | Process for fabricating a thin multi-layer circuit board | Yasuhito Takahashi, Kenji Iida, Masaru Sumi, Yuichiro Ohta, Toshiro Katsube +3 more | 2002-05-21 |
| 6184476 | Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zone | Yasuhito Takahashi, Kenji Iida, Masaru Sumi, Yuichiro Ohta, Toshiro Katsube +3 more | 2001-02-06 |
| 5679268 | Thin multi-layer circuit board and process for fabricating the same | Yasuhito Takahashi, Kenji Iida, Masaru Sumi, Yuichiro Ohta, Toshiro Katsube +3 more | 1997-10-21 |