Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6391220 | Methods for fabricating flexible circuit structures | Lei Zhang, Solomon I. Beilin, James J. Roman | 2002-05-21 |
| 6159666 | Environmentally friendly removal of photoresists used in wet etchable polyimide processes | David D. Ngo | 2000-12-12 |
| 6102710 | Controlled impedance interposer substrate and method of making | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters +4 more | 2000-08-15 |
| 5854534 | Controlled impedence interposer substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters +4 more | 1998-12-29 |
| 5778529 | Method of making a multichip module substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Teruo Murase +3 more | 1998-07-14 |
| 5544017 | Multichip module substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Teruo Murase +3 more | 1996-08-06 |
| 5419038 | Method for fabricating thin-film interconnector | Wen-chou Vincent Wang, Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee +2 more | 1995-05-30 |