Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6106923 | Venting hole designs for multilayer conductor-dielectric structures | Yasuhito Takahashi, Michael G. Peters | 2000-08-22 |
| 6102710 | Controlled impedance interposer substrate and method of making | William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters, James J. Roman +4 more | 2000-08-15 |
| 6090214 | Cleaning method using ammonium persulphate to remove slurry particles from CMP substrates | Dashun Steve Zhou, James J. Roman | 2000-07-18 |
| 6081026 | High density signal interposer with power and ground wrap | Wen-chou Vincent Wang, Yasuhito Takahashi, William T. Chou, Michael G. Peters, Michael G. Lee | 2000-06-27 |
| 6054761 | Multi-layer circuit substrates and electrical assemblies having conductive composition connectors | Mark Thomas McCormack, Hunt Hang Jiang, Albert W. Chan, Yasuhito Takahashi | 2000-04-25 |
| 6050832 | Chip and board stress relief interposer | Michael G. Lee, Wen-chou Vincent Wang | 2000-04-18 |
| 6039889 | Process flows for formation of fine structure layer pairs on flexible films | Lei Zhang, William T. Chou, Michael G. Peters | 2000-03-21 |
| 6034332 | Power supply distribution structure for integrated circuit chip modules | Larry L. Moresco, Richard L. Wheeler, David A. Horine | 2000-03-07 |
| 6025244 | Self-aligned patterns by chemical-mechanical polishing particularly suited to the formation of MCM capacitors | Michael G. Lee | 2000-02-15 |
| 6019665 | Controlled retention of slurry in chemical mechanical polishing | Michael G. Lee | 2000-02-01 |
| 5942373 | Pattern or via structure formed through supplemental electron beam exposure and development to remove image residue | William T. Chou, Wen-chou Vincent Wang | 1999-08-24 |
| 5930890 | Structure and fabrication procedure for a stable post | William T. Chou, David A. Horine, David Kudzuma, Michael G. Lee, Larry L. Moresco +1 more | 1999-08-03 |
| 5916453 | Methods of planarizing structures on wafers and substrates by polishing | Michael G. Lee, William T. Chou, Larry L. Moresco, Wen-chou Vincent Wang | 1999-06-29 |
| 5891354 | Methods of etching through wafers and substrates with a composite etch stop layer | Michael G. Lee, William T. Chou, Michael G. Peters, Wen-chou Vincent Wang | 1999-04-06 |
| 5872696 | Sputtered and anodized capacitors capable of withstanding exposure to high temperatures | Michael G. Peters, Michael G. Lee, Yasuhito Takahashi | 1999-02-16 |
| 5854534 | Controlled impedence interposer substrate | William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters, James J. Roman +4 more | 1998-12-29 |
| 5789140 | Method of forming a pattern or via structure utilizing supplemental electron beam exposure and development to remove image residue | William T. Chou, Wen-chou Vincent Wang | 1998-08-04 |
| 5778529 | Method of making a multichip module substrate | William T. Chou, David Kudzuma, Michael G. Lee, Teruo Murase, Michael G. Peters +3 more | 1998-07-14 |
| 5773889 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, Larry L. Moresco, William T. Chou, David A. Horine, Connie M. Wong | 1998-06-30 |
| 5765279 | Methods of manufacturing power supply distribution structures for multichip modules | Larry L. Moresco, Richard L. Wheeler, David A. Horine | 1998-06-16 |
| 5746903 | Wet chemical processing techniques for plating high aspect ratio features | William T. Chou, Michael G. Lee, Wen-chou Vincent Wang | 1998-05-05 |
| 5722162 | Fabrication procedure for a stable post | William T. Chou, David A. Horine, David Kudzuma, Michael G. Lee, Larry L. Moresco +1 more | 1998-03-03 |
| 5660957 | Electron-beam treatment procedure for patterned mask layers | William T. Chou, David Kudzuma, Wen-chou Vincent Wang | 1997-08-26 |
| 5544017 | Multichip module substrate | William T. Chou, David Kudzuma, Michael G. Lee, Teruo Murase, Michael G. Peters +3 more | 1996-08-06 |
| 5536362 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, Larry L. Moresco, William T. Chou, David A. Horine, Connie M. Wong | 1996-07-16 |