| 8446319 |
Electronic tracking system |
Evan Parker, Bruce Hammond, Tom Molinaro |
2013-05-21 |
| 7842599 |
Bumping electronic components using transfer substrates |
— |
2010-11-30 |
| 7837083 |
Forming solder balls on substrates |
Tom Molinaro |
2010-11-23 |
| 7819301 |
Bumping electronic components using transfer substrates |
— |
2010-10-26 |
| 7654432 |
Forming solder balls on substrates |
Tom Molinaro |
2010-02-02 |
| 7604153 |
Forming solder balls on substrates |
Tom Molinaro |
2009-10-20 |
| 7288471 |
Bumping electronic components using transfer substrates |
— |
2007-10-30 |
| 7007833 |
Forming solder balls on substrates |
Tom Molinaro |
2006-03-07 |
| 6609652 |
Ball bumping substrates, particuarly wafers |
Tom Molinaro |
2003-08-26 |
| 6293456 |
Methods for forming solder balls on substrates |
Tom Molinaro |
2001-09-25 |
| 6126059 |
Captured-cell solder printing and reflow methods and apparatuses |
Thomas E. Molinaro, David G. Love, Patricia R. Boucher |
2000-10-03 |
| 5988487 |
Captured-cell solder printing and reflow methods |
Thomas E. Molinaro, David G. Love, Patricia R. Boucher |
1999-11-23 |
| 4577398 |
Method for mounting a semiconductor chip |
John W. Sliwa, Roy J. Burt, Chune Lee, Cindy A. Johnson |
1986-03-25 |
