Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8446319 | Electronic tracking system | Evan Parker, Bruce Hammond, Tom Molinaro | 2013-05-21 |
| 7842599 | Bumping electronic components using transfer substrates | — | 2010-11-30 |
| 7837083 | Forming solder balls on substrates | Tom Molinaro | 2010-11-23 |
| 7819301 | Bumping electronic components using transfer substrates | — | 2010-10-26 |
| 7654432 | Forming solder balls on substrates | Tom Molinaro | 2010-02-02 |
| 7604153 | Forming solder balls on substrates | Tom Molinaro | 2009-10-20 |
| 7288471 | Bumping electronic components using transfer substrates | — | 2007-10-30 |
| 7007833 | Forming solder balls on substrates | Tom Molinaro | 2006-03-07 |
| 6609652 | Ball bumping substrates, particuarly wafers | Tom Molinaro | 2003-08-26 |
| 6293456 | Methods for forming solder balls on substrates | Tom Molinaro | 2001-09-25 |
| 6126059 | Captured-cell solder printing and reflow methods and apparatuses | Thomas E. Molinaro, David G. Love, Patricia R. Boucher | 2000-10-03 |
| 5988487 | Captured-cell solder printing and reflow methods | Thomas E. Molinaro, David G. Love, Patricia R. Boucher | 1999-11-23 |
| 4577398 | Method for mounting a semiconductor chip | John W. Sliwa, Roy J. Burt, Chune Lee, Cindy A. Johnson | 1986-03-25 |