Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10038259 | Low insertion loss package pin structure and method | Paul Ying-Fung Wu, Sarajuddin Niazi, Suresh Ramalingam | 2018-07-31 |
| 8386229 | Integrated circuit package component and ball grid array simulation model | Sanjay Mehta, Richard L. Wheeler | 2013-02-26 |
| 6937971 | System and method for determining the desired decoupling components for a power distribution system having a voltage regulator module | Larry D. Smith, Tanmoy Roy | 2005-08-30 |
| 6789241 | Methodology for determining the placement of decoupling capacitors in a power distribution system | Larry D. Smith, Sungjun Chun | 2004-09-07 |
| 6571184 | System and method for determining the decoupling capacitors for power distribution systems with a frequency-dependent target impedance | Larry D. Smith, Tanmoy Roy | 2003-05-27 |
| 6564355 | System and method for analyzing simultaneous switching noise | Larry D. Smith, Tanmoy Roy | 2003-05-13 |
| 6532439 | Method for determining the desired decoupling components for power distribution systems | Larry D. Smith, Tanmoy Roy | 2003-03-11 |
| 6385565 | System and method for determining the desired decoupling components for power distribution systems using a computer system | Larry D. Smith | 2002-05-07 |
| 6195613 | Method and system for measuring equivalent series resistance of capacitors and method for decoupling power distribution systems | Tanmoy Roy, Larry D. Smith, Thomas J. Pelc, Douglas W. Forehand | 2001-02-27 |