Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5749988 | Reworkable die attachment to heat spreader | Jacques Leibovitz, Voddarahalli K. Nagesh, Greg M. Irby | 1998-05-12 |
| 5621615 | Low cost, high thermal performance package for flip chips with low mechanical stress on chip | Jacques Leibovitz, Voddarahalli K. Nagesh | 1997-04-15 |
| 5484964 | Surface mounting pin grid arrays | by Shirley B. Dawson, executor, Jacques Leibovitz, Voddarahalli K. Nagesh | 1996-01-16 |
| 5268048 | Reworkable die attachment | Jacques Leibovitz, Hilmar W. Spieth, Voddarahalli K. Nagesh | 1993-12-07 |