Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828220 | Flip chip-in-leadframe package and process | Rajendra D. Pendse, Marcos Karnezos | 2004-12-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828220 | Flip chip-in-leadframe package and process | Rajendra D. Pendse, Marcos Karnezos | 2004-12-07 |