Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5159750 | Method of connecting an IC component with another electrical component | Vivek B. Dutta, Mark L. DiOrio, Jon T. Ewanich | 1992-11-03 |
| 5146310 | Thermally enhanced leadframe | Jaime A. Bayan, Mark L. DiOrio, Young I. Kwon | 1992-09-08 |
| 5049976 | Stress reduction package and process | Rajendra D. Pendse | 1991-09-17 |
| 5008734 | Stadium-stepped package for an integrated circuit with air dielectric | Vivek B. Dutta, Mark L. DiOrio, Jon T. Ewanich | 1991-04-16 |